Thermally Induced Vibration of Circular Plate
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چکیده
منابع مشابه
Thermally Induced Vibration, Circular Plates
1. Tummala RR (2001) Fundamentals of microsystems packaging. McGraw-Hill International Edition, New York 2. JEDEC (2002) Design standard: design requirements for outlines of solid state and related products; JEDEC Publication 95, Design Guide 4.14-1/D, Ball Grid Array Package, JEDEC Solid State Technology Association 3. Vujosevic M (2006) Warpage of flip chip packages. In: Proceedings of IMECE2...
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ژورنال
عنوان ژورنال: Bulletin of JSME
سال: 1978
ISSN: 0021-3764,1881-1426
DOI: 10.1299/jsme1958.21.1703